Tezzaron Chooses CAST IP Core for First Ever Stacked 3D IC Processor

SHINAGAWA, Tokyo, IP Japan, May 18 -- Customer Tezzaron(R) Semiconductor has implemented a core from intellectual property (IP) provider CAST, Inc., using patented wafer stacking technology to produce the first three-dimensional integrated circuit (3D IC) processor.

Tezzaron's 3D IC processor uses the vertical connections and precise stacking of their FaStack(R) process to place 128 Kbytes of SRAM memory above the 8051-type processor and bind the two layers into a single device. Using a 160 nm technology, the resulting 3D IC runs up to ten times faster and requires only about 1/10th the power of a typical 8051. The core, CAST's R80515, uses a reduced instruction set and other features that make it an effective and efficient embedded processor or controller.

"We wanted to demonstrate our technology with a workhorse processor that's still used in thousands of products and devices around the world," said Robert Patti, Tezzaron's chief technology officer. "CAST proved to be a great partner-easy to work with and providing excellent support-and implementing their core was painless and straightforward."

Tezzaron has delivered the 3D processor to several potential customers for evaluation. More information on both the processor and the ... // 57% Remaining